54f139 datasheets

MC14025B B-suffix Series CMOS Gates The B Series logic gates are constructed with P and N channel enhancement mode devices in a single monolithic structure (Complementary MOS). Their primary use is where low power dissipation and/or high noise immunity is desired..

High Speed Optocoupler, 100 kBd, Low Input Current, Photodiode Darlington Output Features • High Current Transfer Ratio, 300 % • Low Input Current, 0.5 mA • High Output Current, 60 mA • Isolation Test Voltage, 5300 VRMS • TTL Compatible Output, VOL = 0.1 V • High Common Mode Rejection, 500 V/µs • Adjustable Bandwidth-Access to Base

JD54F139SFA 54F139 - Dual 1-of-4 Decoder/Demultiplexer, Package: Lcc, Pin Nb=20 JD54F160BEA 54F160A - Synchronous Presettable BCD Decade Counter, Package: Cerdip, Pin Nb=16 JD54F161SFA DM54LS161A - Synchronous 4-Bit Binary Counter With Asynchronous Clear, Package: Cerdip, Pin Nb=16 54F00/BCA datasheet, cross reference, circuit and application notes in pdf format. 54F00/BCA datasheet & applicatoin notes - Datasheet Archive The Datasheet Archive

Jan 06, 2017 · QX5252 Datasheet - LED Driver, TO-94, DIP-8 Pin - QXMD, QX5252F datasheet, QX5252 pdf, QX5252 pinout, QX5252 manual, QX5252 schematic, QX5252 equivalent. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd Japan Ltd 1111 West Bardin Road Fax ( a49) 0-180-530 85 86 13th Floor Straight Block Tel 81-043-299-2309 Arlington TX 76017 Email cnjwge @tevm2nsccom Ocean Centre 5 Canton Rd Fax 81-043-299-2408 distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information. (3) Test boards conditions: (a) 2 inches x 2 inches, 4 layers, thickness: 0.062 inch (b) 2 oz. copper traces located on the top of the PCB (c) 2 oz. copper ground planes on the 2 internal layers and bottom ... distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information. (3) Test boards conditions: (a) 2 inches x 2 inches, 4 layers, thickness: 0.062 inch (b) 2 oz. copper traces located on the top of the PCB (c) 2 oz. copper ground planes on the 2 internal layers and bottom ...